Gary E Legerton

Title: Innovations by Gary E Legerton

Introduction

Gary E Legerton is an accomplished inventor based in La Mesa, California. He has made significant contributions to the field of electronics packaging through his innovative methods. His work focuses on enhancing the functionality and efficiency of conductive core materials.

Latest Patents

Gary holds a patent for "Methods to produce insulated conductive through-features in core." This invention discloses methods for producing insulated, conductive through-features in conductive core materials used for electronics packaging. The methods utilize protective mask technology to selectively remove material from planar conductive core material that has been encapsulated in electrically insulated materials. By filling the cavity in the conductive core material with an electrically insulated material, the through-feature is electrically isolated from the remainder of the core material. This results in a conductive through-feature that completely transverses the core of the substrate board. Additionally, the invention provides planar substrates for multilayer printed circuit boards or chip carriers, which comprise the conductive through-features produced by these methods. Gary has 1 patent to his name.

Career Highlights

Gary is currently associated with Ormet Corporation, where he continues to develop innovative solutions in electronics packaging. His expertise in the field has positioned him as a valuable asset to the company.

Collaborations

Throughout his career, Gary has collaborated with notable professionals, including Pradeep R Gandhi and Samuel Fu. These collaborations have further enriched his work and contributed to advancements in the industry.

Conclusion

Gary E Legerton's innovative methods for producing insulated conductive through-features have made a significant impact on electronics packaging. His contributions continue to shape the future of the industry.