Rochester, NY, United States of America

Gary D Smith


Average Co-Inventor Count = 5.1

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 1995-2007

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4 patents (USPTO):Explore Patents

Title: The Innovations of Gary D. Smith

Introduction

Gary D. Smith is an accomplished inventor based in Rochester, NY (US). He has made significant contributions to the field of imaging technology, holding a total of 4 patents. His work focuses on improving the performance and durability of imaging elements.

Latest Patents

One of his latest patents is titled "Imaging element having improved crack propagation during conversion." This invention relates to an imaging member that comprises an imaging layer and a base. The base consists of a closed cell foam core sheet, which is adhered to an upper and lower flange sheet. The foam core sheet has a modulus ranging from 100 to 2758 MPa and a tensile toughness between 0.344 and 35 MPa. The upper and lower flange sheets have a modulus between 1380 and 20000 MPa and a toughness ranging from 1.4 to 210 MPa. This innovative design aims to enhance the crack propagation characteristics during the conversion process.

Career Highlights

Gary D. Smith is currently associated with Eastman Kodak Company, where he continues to develop cutting-edge imaging technologies. His expertise in the field has led to advancements that benefit various applications in imaging.

Collaborations

Throughout his career, Gary has collaborated with notable colleagues, including Yeh-Hung Lai and Suresh Sunderrajan. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Gary D. Smith's contributions to imaging technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence advancements in imaging elements, showcasing the importance of innovation in technology.

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