Gary D Messner

Title: Innovations by Gary D. Messner

Introduction

Gary D. Messner is an accomplished inventor based in King, North Carolina. He has made significant contributions to the field of electronics, particularly in the manufacturing of electronic modules. With a total of three patents to his name, Messner's work showcases his expertise and innovative spirit.

Latest Patents

Messner's latest patents include a "Process for manufacturing a module" and a "Method for forming an electronic module having backside seal." In the first patent, a meta-module is created with circuitry for multiple modules on a laminated substrate. The design includes component areas with metallic structures for shielding. The final product involves an overmold body that encapsulates the modules, with electromagnetic shielding applied to protect the circuitry. The second patent follows a similar approach, emphasizing the importance of shielding and structural integrity in electronic modules.

Career Highlights

Gary D. Messner has been associated with RF Micro Devices, Inc., where he has contributed to various projects and innovations. His work has been instrumental in advancing the technology used in electronic modules, making them more efficient and reliable.

Collaborations

Messner has collaborated with notable colleagues, including Dan Carey and Jeffrey Scott Walker. Their combined efforts have led to advancements in the field of electronics and have fostered a collaborative environment for innovation.

Conclusion

Gary D. Messner's contributions to the field of electronics through his patents and collaborations highlight his role as a significant inventor. His innovative processes continue to influence the development of electronic modules, showcasing the importance of creativity and teamwork in technological advancements.