Company Filing History:
Years Active: 1995-1996
Title: Futoshi Sonoda: Innovator in Integrated Circuit Packaging
Introduction
Futoshi Sonoda is a notable inventor based in Nagoya, Japan. He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His innovative methods have advanced the production processes in this critical area of technology.
Latest Patents
Sonoda's latest patents include a "Jig for electroplating lead pins of an integrated circuit package" and a "Method of electroplating lead pins of integrated circuit package." Both patents disclose methods for producing integrated circuit packages by establishing direct electrical connections with lead pins joined to a package substrate. The process involves force-fitting lead pins into openings in a plating jig made of electrically conductive material, ensuring that the side surfaces of the lead pins contact the jig. This method allows for effective electroplating while maintaining electrical conduction. After the electroplating process, the lead pins are separated from the jig through a movement that differs from their axial direction. Various jigs used for implementing these methods are also described in his patents.
Career Highlights
Futoshi Sonoda is currently employed at NGK Spark Plug Company, Limited, where he continues to innovate in the field of integrated circuit technology. His work has been instrumental in enhancing the efficiency and effectiveness of electroplating processes in electronic components.
Collaborations
Sonoda has collaborated with notable coworkers, including Takahiro Shibata and Kazuo Kimura. Their combined expertise has contributed to the successful development of innovative solutions in integrated circuit packaging.
Conclusion
Futoshi Sonoda's contributions to the field of integrated circuit packaging through his patents and work at NGK Spark Plug Company, Limited, highlight his role as a key innovator in the industry. His methods for electroplating lead pins have paved the way for advancements in electronic manufacturing processes.