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1 out of 832,812 Years Active: 2004-2006
Title: Fumio Okuda: Innovator in Plating Film Technology
Introduction
Fumio Okuda is a notable inventor based in Simonoseki, Japan. He has made significant contributions to the field of plating film technology, holding 2 patents that enhance the solderability of plating films for lead-free solder applications. His innovative methods have the potential to improve productivity and reduce production costs in the manufacturing process.
Latest Patents
Okuda's latest patents include a method for forming a plating film. This method involves applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath. The process includes maintaining the object at a second current density that is lower than the first. This innovative approach improves the solderability of plating films, allowing for enhanced productivity and reduced costs.
Career Highlights
Throughout his career, Fumio Okuda has worked with prominent companies, including Sharp Kabushiki Kaisha Corporation. His experience in these organizations has contributed to his expertise in plating film technology and innovation.
Collaborations
Okuda has collaborated with notable coworkers such as Yoshihiko Matsuo and Ryukichi Ikeda. Their combined efforts have further advanced the field of plating film technology.
Conclusion
Fumio Okuda's contributions to plating film technology demonstrate his innovative spirit and commitment to improving manufacturing processes. His patents reflect a deep understanding of the challenges in the industry and offer practical solutions that benefit production efficiency.