This inventor holds 1 USPTO granted patent. Top assignee: Kyocera Slc Technologies Corporation. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: Fumio Kumokawa: Innovator in Wiring Board Technology
Introduction
Fumio Kumokawa is a notable inventor based in Hirakata, Japan. He has made significant contributions to the field of wiring board technology, holding a patent that showcases his innovative approach to design and functionality.
Latest Patents
Kumokawa's most recent patent involves a wiring board that features a core substrate with multiple through-holes. This design includes buildup insulating layers and buildup wiring layers that are alternately laminated on both the upper and lower surfaces of the core substrate. The patent outlines a unique arrangement of through-hole groups in different regions of the core board, optimizing the connection to semiconductor element pads while maintaining structural integrity.
Career Highlights
Fumio Kumokawa is currently employed at Kyocera SLC Technologies Corporation, where he continues to develop advanced technologies in wiring boards. His work has been instrumental in enhancing the performance and reliability of electronic components.
Collaborations
Kumokawa collaborates with Hiroyuki Fukushima, contributing to the innovative projects at Kyocera SLC Technologies Corporation. Their teamwork has led to advancements in wiring board technology.
Conclusion
Fumio Kumokawa's contributions to wiring board technology exemplify his innovative spirit and dedication to improving electronic design. His patent reflects a deep understanding of the complexities involved in modern electronics, making him a valuable asset in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile