Beijing, China

Fulong Dai


Average Co-Inventor Count = 9.0

ph-index = 1


Company Filing History:


Years Active: 2024

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Fulong Dai: Innovator in Composite Aerogel Technology

Introduction

Fulong Dai is a prominent inventor based in Beijing, China. He has made significant contributions to the field of photothermal evaporation materials. His innovative work has led to the development of a unique composite aerogel that utilizes graphdiyne motifs.

Latest Patents

Fulong Dai holds a patent for a "Composite aerogel based on graphdiyne motif arrangement and preparation method thereof." This invention involves a method for creating a composite aerogel that includes graphdiyne-coated reduced graphene oxide. The process begins with growing graphdiyne on a surface of graphene oxide, followed by a series of steps that culminate in the formation of a gel structure, which is then freeze-dried to produce the final aerogel product. This technology has potential applications in various fields due to its unique properties.

Career Highlights

Fulong Dai is affiliated with the University of Science and Technology Beijing. His work at the university has allowed him to explore advanced materials and their applications. He has been recognized for his innovative approach to material science and has contributed to the academic community through his research and patents.

Collaborations

Fulong Dai has collaborated with notable colleagues, including Yue Hua Zhang and Zhaozhao Xiong. These partnerships have enhanced his research efforts and contributed to the advancement of technology in their field.

Conclusion

Fulong Dai's contributions to the development of composite aerogels highlight his innovative spirit and dedication to advancing material science. His work continues to inspire future research and applications in various industries.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…