Fu-Chung Wu

Title: Fu-Chung Wu: Innovator in Memory Module Technology

Introduction

Fu-Chung Wu is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic components, particularly in memory module technology. With a total of 2 patents to his name, Wu continues to push the boundaries of innovation in his industry.

Latest Patents

Wu's latest patents include an "Expansion structure of memory module slot" and a "Computer-assisted electronic component schematic linking method." The expansion structure of memory module slots provides a unique configuration where a circuit switch board and a substrate are integrated into a motherboard. This design allows for multiple memory module slots, enhancing the connectivity and functionality of memory modules. The computer-assisted schematic linking method streamlines the process of linking electronic components by utilizing a database to facilitate the selection and integration of various components into a complete schematic chart.

Career Highlights

Fu-Chung Wu is currently employed at Inventec Corporation, where he applies his expertise in electronic components. His work has been instrumental in developing innovative solutions that improve the efficiency and performance of electronic devices. Wu's contributions have positioned him as a key figure in the advancement of memory module technology.

Collaborations

Wu collaborates with talented colleagues such as Sheng-Yuan Tsai and Shih-Jui Tung. Together, they work on various projects that aim to enhance the capabilities of electronic components and systems.

Conclusion

Fu-Chung Wu's innovative spirit and dedication to advancing technology in memory modules make him a significant contributor to the field of electronics. His patents reflect his commitment to improving the functionality and efficiency of electronic devices.