Hudson, WI, United States of America

Frederick Eisenmann


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: **Frederick Eisenmann: Innovator in Aluminum Metallization Technology**

Introduction

Frederick Eisenmann, a distinguished inventor based in Hudson, Wisconsin, has made significant contributions to the field of integrated circuit (IC) fabrication. With one patent to his name, he has developed an innovative method for aluminum metallization that enhances the performance and quality of semiconductor devices.

Latest Patents

Eisenmann's patent focuses on an aluminum metallization method and product which employs the deposition of aluminum as a crucial metallization layer for IC fabrication. This method is notable for doping aluminum with small amounts of copper to improve its electrical properties. Eisenmann emphasizes low-temperature deposition, specifically below 300°C, to maintain optimal microstructure and surface roughness. This process can lead to copper precipitates that are challenging to remove, but through annealing the formed layer, either before or after applying capping layers, Eisenmann is able to drive the copper back into solution, enabling small dimension fabrication.

Career Highlights

Currently, Frederick Eisenmann works with Cypress Semiconductor Corporation, a leading organization in the semiconductor space. His role involves utilizing his expertise in material science to advance semiconductor technology. His innovative approach to metallization has undoubtedly contributed to enhancing the efficiency and performance of products developed by the company.

Collaborations

Eisenmann is known for his collaborative spirit, working alongside talented professionals like Mark Smith and Ivan Petrov Ivanov. Together, they leverage their combined expertise to push the boundaries of semiconductor technology, focusing on developing methods that enhance device performance and reliability.

Conclusion

Frederick Eisenmann's contributions to aluminum metallization in IC fabrication reflect his commitment to innovation within the semiconductor industry. His patent not only demonstrates his technical prowess but also signifies his ongoing dedication to improving technology through collaboration and research. As he continues to work with Cypress Semiconductor Corporation and his colleagues, the impact of his work is likely to reverberate throughout the field for years to come.

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