Frank Gelhausen

Title: Frank Gelhausen: Innovator in Photonics Packaging

Introduction

Frank Gelhausen is a notable inventor based in Langenhagen, Germany. He has made significant contributions to the field of photonics, particularly in the packaging of laser chips. With a total of 2 patents to his name, Gelhausen continues to push the boundaries of innovation in his field.

Latest Patents

One of Gelhausen's latest patents focuses on the packaging of a directly modulated laser chip in a photonics module. This innovative package structure includes a thermoelectric cooler with multiple conductor traces formed in a cool surface. The design features a directly modulated laser (DML) chip, where the first electrode is attached to the cool surface, while the second electrode is positioned at a distance away. Additionally, the package structure incorporates an interposer with a plurality of through-holes, ensuring alignment with the conductor traces. A driver is also included, which is disposed on the interposer's second surface, providing a galvanically coupled output port directly to the DML chip's second electrode.

Career Highlights

Frank Gelhausen is currently employed at Inphi Corporation, where he applies his expertise in photonics and laser technology. His work has been instrumental in advancing the capabilities of photonic modules, making them more efficient and effective.

Collaborations

Throughout his career, Gelhausen has collaborated with talented individuals such as Ahmed Sanaa, Ahmed Awny, and Edward Pillai. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Frank Gelhausen is a prominent figure in the field of photonics, with a focus on laser chip packaging. His contributions through patents and collaborations highlight his commitment to advancing technology in this vital area. His work at Inphi Corporation continues to influence the future of photonics.