Company Filing History:
Years Active: 2003
Title: Frank E Mantz: Innovator in PCB Technology
Introduction
Frank E Mantz is a notable inventor based in Hawthorne, CA (US). He has made significant contributions to the field of printed circuit board (PCB) technology. With a total of 2 patents, Mantz has focused on innovations that enhance the efficiency and effectiveness of 3-D stacking in PCB design.
Latest Patents
Mantz's latest patents include a "Post in ring interconnect using for 3-D stacking" and a "Retaining ring interconnect used for 3-D stacking." The first patent describes a method where a retaining ring is formed on a pad on the bottom surface of a top PCB substrate, which is then stacked with a bottom PCB substrate. A post is formed on a pad on the top surface of the bottom PCB substrate. Conductive paste is applied on the pad of the top substrate and retained in a pocket defined by the retaining ring. This innovative design allows for a eutectic bond to be formed between the two substrates through a compression step. The second patent outlines a retaining ring interconnect where a retaining ring is formed on the perimeter of pads on two adjoining surfaces of PCB substrates. Conductive paste is applied between these pads, and through a heat compression process, the retaining rings bond the two substrates together, forming a eutectic bond.
Career Highlights
Frank E Mantz is currently employed at Dpac Technologies Corp., where he continues to develop innovative solutions in PCB technology. His work has been instrumental in advancing the capabilities of 3-D stacking, which is crucial for modern electronic devices.
Collaborations
Mantz collaborates with Glen E Roeters, contributing to the innovative environment at Dpac Technologies Corp. Their combined expertise enhances the company's ability to push the boundaries of PCB technology.
Conclusion
Frank E Mantz is a distinguished inventor whose work in PCB technology has led to significant advancements in 3-D stacking methods. His patents reflect a commitment to innovation and efficiency in electronic design.