Company Filing History:
Years Active: 1993-1999
Title: The Innovative Contributions of Floyd E. Stumpff
Introduction
Floyd E. Stumpff is a notable inventor based in Elmira, NY (US), recognized for his significant contributions to the field of extrusion technology. With a total of 5 patents to his name, Stumpff has made advancements that enhance manufacturing processes, particularly in the creation of honeycomb structures.
Latest Patents
Stumpff's latest patents include the "Bonded Pin Extrusion Die and Method." This innovation discloses a honeycomb extrusion die and a method of making the die. The die is constructed by bonding a die discharge section, formed as a separate pin array, to a separate die body that incorporates an array of feed channels. The pin array consists of multiple pins attached to a body-compatible pin support, which is removed after the bonding process. The pins can be made from hard wear materials and can have various cross-sectional shapes to improve extrusion uniformity and create honeycomb cells of different shapes.
Career Highlights
Floyd E. Stumpff is currently employed at Corning Incorporated, where he continues to develop innovative solutions in his field. His work has significantly impacted the manufacturing processes used in various industries.
Collaborations
Throughout his career, Stumpff has collaborated with notable colleagues, including Harry A. Kragle and Joseph F. Cocchetto. These collaborations have contributed to the advancement of technology in their respective fields.
Conclusion
Floyd E. Stumpff's contributions to the field of extrusion technology demonstrate his innovative spirit and commitment to improving manufacturing processes. His patents reflect a deep understanding of material science and engineering, making him a valuable asset in the industry.