Company Filing History:
Years Active: 2009
Title: Florian Schupp: Innovator in Electronic Circuit Design
Introduction
Florian Schupp is a notable inventor based in Wuppertal, Germany. He has made significant contributions to the field of electronic circuit design, particularly in improving heat dissipation in electronic configurations. His innovative approach has led to the development of a unique patent that addresses critical challenges in the industry.
Latest Patents
Florian Schupp holds a patent for an "Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink." This invention aims to enhance the heat dissipation capacity in electronic circuit configurations. The design features one or more printed circuit boards that are thermally coupled by one flat side to a heat sink, which includes at least one coolant duct. The flat side of the printed circuit board is positioned to immediately adjoin the coolant duct, thereby improving thermal management.
Career Highlights
Florian Schupp is currently employed at Siemens VDO Automotive AG, where he applies his expertise in electronic circuit design. His work at Siemens has allowed him to collaborate with other talented professionals in the field, contributing to advancements in automotive technology.
Collaborations
Some of Florian's coworkers include Volker Karrer and Bernhard Lichtinger. Their collective efforts in the industry have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.
Conclusion
Florian Schupp's contributions to electronic circuit design exemplify the importance of innovation in technology. His patent reflects a commitment to improving efficiency and performance in electronic systems. Through his work at Siemens VDO Automotive AG, he continues to influence the field positively.