Company Filing History:
Years Active: 2022
Title: **Inventor Spotlight: Fernanda Bortolane Bueno**
Introduction
Fernanda Bortolane Bueno is a prominent inventor based in Sao Paulo, Brazil. With a strong focus on innovative packaging solutions, she has made significant contributions to the field. Her expertise in minimizing pellet blocking through low-stress packaging design showcases her dedication to improving efficiency in product handling and transport.
Latest Patents
Fernanda holds a patent for her invention titled "Low stress packaging design to minimize pellet blocking." This patent features a unique packaging configuration that includes a pallet with various attributes, such as a top surface, a bottom surface, and a specified height. The design encompasses a first stack of bagged goods, including multiple layers, and a supportive structure with at least four walls, which strategically interacts with the stack of goods to ensure stability and reduced stress during handling. The innovative use of an air gap between the top layer of the goods and the support structure helps to preserve product integrity.
Career Highlights
Fernanda is affiliated with Dow Global Technologies LLC, where she utilizes her skills in research and development to create impactful packaging solutions. Her work has not only reinforced the significance of quality and efficiency in packaging but has also emphasized the importance of innovative approaches in industrial practices.
Collaborations
Throughout her career, Fernanda has collaborated with talented professionals, including Shrikant Dhodapkar and Rocklyn P Gravouilla. These partnerships amplify her efforts in driving innovation and achieving breakthroughs in packaging technology.
Conclusion
Fernanda Bortolane Bueno stands out as an influential inventor in the field of packaging design. Her patented innovations aim to enhance operational efficiency and protect products during transport, making her a valuable asset in the industry. As she continues to refine her inventions, her impact on packaging solutions will undoubtedly resonate within the market, paving the way for future advancements.