Company Filing History:
Years Active: 2024-2025
Title: Eungchang Lee: Innovator in Semiconductor Packaging
Introduction
Eungchang Lee is a prominent inventor based in Hanam-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work is instrumental in advancing technology in this critical area.
Latest Patents
Eungchang Lee's latest patents include innovative designs for semiconductor packages. One patent describes a semiconductor package that features a substrate and at least one semiconductor chip. This design includes a body layer with a top and bottom surface, a first thermal conductive plate connected to a ground terminal of the semiconductor chip, and a thermal conductive via that penetrates the body layer. Another patent focuses on a semiconductor package that incorporates vertically-stacked semiconductor chips. This design includes first, second, and third connection terminals that interconnect the semiconductor chips, enhancing their functionality and efficiency.
Career Highlights
Eungchang Lee is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the company's innovative product offerings.
Collaborations
Eungchang Lee has collaborated with notable coworkers, including Jae Choon Kim and Kyung Suk Oh. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Eungchang Lee's contributions to semiconductor packaging exemplify his dedication to innovation in technology. His patents reflect a commitment to advancing the field and improving the efficiency of semiconductor devices.