Perai, Malaysia

Erwan Basiron


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Erwan Basiron: Innovator in Surface-Mount Technology Testing

Introduction

Erwan Basiron is a notable inventor based in Perai, Malaysia. He has made significant contributions to the field of surface-mount technology, particularly in the testing of solder joints in printed circuit board (PCB) assemblies. His innovative approach has the potential to enhance the reliability and efficiency of electronic components.

Latest Patents

Erwan holds a patent for his invention titled "Analyses of surface-mount-technology components using fluorescent-dye penetrants." This patent focuses on methods and apparatus for testing solder joints of a PCB assembly using fluorescent-dye penetrants. The use of a suitable fluorescent-dye penetrant can significantly improve the sensitivity of a Dye and Pry test compared to conventional dye penetrants. His invention employs an automated fluorescence imaging system that utilizes a translation stage to move individual solder-joint parts into the field of view of a fluorescence microscope. This system captures high-resolution fluorescence images, enabling precise automated scanning and quantification of cracks in solder joints.

Career Highlights

Erwan is currently employed at Western Digital Technologies, Inc., where he continues to develop and refine his innovative testing methods. His work has been instrumental in advancing the quality assurance processes within the electronics industry.

Collaborations

Erwan collaborates with talented individuals such as John Patrick Burke and Kamarol Azmin Kamaruddin, contributing to a dynamic work environment that fosters innovation and creativity.

Conclusion

Erwan Basiron's contributions to the field of surface-mount technology testing exemplify the impact of innovation in enhancing electronic component reliability. His patented methods and collaborative efforts continue to shape the future of PCB assembly testing.

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