Tamba, Japan

Erubi Suzuki

USPTO Granted Patents = 2 

Average Co-Inventor Count = 1.6

ph-index = 1


Location History:

  • Tokyo, JP (2020)
  • Tamba, JP (2023)

Company Filing History:


Years Active: 2020-2023

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2 patents (USPTO):Explore Patents

Title: Erubi Suzuki: Innovator in Ultrasonic Bonding Technology

Introduction

Erubi Suzuki is a notable inventor based in Tamba, Japan. He has made significant contributions to the field of ultrasonic bonding technology, holding a total of 2 patents. His work focuses on improving the quality and efficiency of bonding processes in various applications.

Latest Patents

Erubi Suzuki's latest patents include an ultrasonic bonding apparatus, an ultrasonic bonding inspection method, and a method for fabricating ultrasonically-bonded portions. The ultrasonic bonding apparatus features an ultrasonic bonding machine equipped with an ultrasonic tool that applies ultrasonic waves to a bonding target member. This member is mounted on a fixed object secured to a jig while a bonding member is pressed against it. Additionally, the bonding inspection apparatus inspects the bonding quality of both the bonding target member and the bonding member. It includes a bonded-state measuring device that detects vibrations in the jig or housing of the ultrasonic bonding machine, outputting a detection signal. A bonded-state determination device then assesses the bonding state based on this signal during the bonding process.

Another significant patent involves a method of manufacturing semiconductor devices. This method entails forming a first and second electrode on an insulating layer, creating a barrier made of the same material as a metal terminal on the peripheral portion of the ultrasonic bonding area, and applying pressing force along with ultrasonic vibration to bond the metal terminal to the first electrode.

Career Highlights

Erubi Suzuki is currently employed at Mitsubishi Electric Corporation, where he continues to innovate in the field of ultrasonic bonding technology. His work has been instrumental in advancing the capabilities of bonding processes, particularly in the semiconductor industry.

Collaborations

Some of his notable coworkers include Minoru Egusa and Shingo Sudo, who have collaborated with him on various projects within Mitsubishi Electric Corporation.

Conclusion

Erubi Suzuki's contributions to ultrasonic bonding technology have established him as a key figure in the field. His innovative patents and ongoing work at Mitsubishi Electric Corporation continue to influence advancements in bonding processes.

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