Tokyo, Japan

Eriko Tsukuda


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Eriko Tsukuda: Innovator in Packaging Technology

Introduction

Eriko Tsukuda is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of packaging technology, particularly in the development of materials suitable for boil and retort treatments. His innovative approach has led to advancements that enhance the efficiency and safety of packaging solutions.

Latest Patents

Eriko Tsukuda holds a patent for a packaging material designed for boil and retort treatment. This invention aims to provide an inexpensive packaging solution that exhibits excellent low-elution properties and transparency. The patent describes a packaging material that includes a transparent gas barrier film layer, an adhesive layer, and a sealant film layer. Notably, when subjected to heating at 121°C for two hours in contact with 95% ethanol, the elution of unreacted residual ε-caprolactam and ω-laurolactam is minimal, ensuring safety and quality in food packaging.

Career Highlights

Tsukuda is associated with Dai Nippon Printing Co., Ltd., a leading company in the printing and packaging industry. His work has been instrumental in advancing the company's capabilities in producing high-quality packaging materials. His dedication to innovation has positioned him as a key figure in the development of safe and effective packaging solutions.

Collaborations

Eriko Tsukuda collaborates with talented individuals such as Noriko Sakamoto and Noriyuki Shiina. These partnerships enhance the creative process and contribute to the successful development of innovative packaging technologies.

Conclusion

Eriko Tsukuda's contributions to packaging technology reflect his commitment to innovation and quality. His patent for a specialized packaging material demonstrates the potential for advancements in safety and efficiency within the industry. His work continues to influence the future of packaging solutions.

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