Erich K Rubel

Title: Erich K Rubel: Innovator in Microelectronic Bonding Technologies

Introduction

Erich K Rubel is a notable inventor based in Phoenix, AZ, recognized for his contributions to microelectronic packaging technologies. With a focus on enhancing the bonding processes in microelectronic structures, Rubel has developed innovative solutions that improve the reliability and efficiency of electronic devices.

Latest Patents

Rubel holds a patent for "Die attachment utilizing grooved surfaces." This invention describes a substrate for a microelectronic package that features grooves on its surface, designed to facilitate bonding with a die. The method involves preparing a substrate with a grooved surface that allows for a uniform die bond while maintaining an effective thermal path. The process includes heating the substrate, contacting it with the die, and scrubbing the die to ensure a strong eutectic bond. This innovative approach enhances the performance of microelectronic structures by ensuring a reliable connection between the substrate and the die.

Career Highlights

Erich K Rubel is associated with CMC Wireless Components, Inc., where he applies his expertise in microelectronics to develop cutting-edge technologies. His work has significantly contributed to advancements in the field, particularly in the area of die attachment methods.

Collaborations

Rubel has collaborated with notable colleagues, including Jonathan H Harris and Gabriel Carrasco, to further enhance the development of microelectronic bonding technologies.

Conclusion

Erich K Rubel's innovative work in microelectronic bonding processes exemplifies the importance of advancements in technology for the electronics industry. His contributions continue to influence the design and functionality of modern electronic devices.