Company Filing History:
Years Active: 2012
Title: Innovator Spotlight: Eric Y. Chu
Introduction: Eric Y. Chu is a prominent inventor based in Palo Alto, CA, known for his innovative contributions to wireless sensor technology. With a focus on integrating advanced materials and devices, he has made a significant impact in the field of passive sensing applications.
Latest Patents: Eric holds a patent for a "Passive hybrid sensing tag with flexible substrate SAW device". This invention involves the integration of surface acoustic wave (SAW) filters, microfabricated transmission lines, and sensors onto polymer substrates, enabling a passive wireless sensor platform. The technology utilizes incident microwave pulses on an integrated antenna that are converted to acoustic waves via a SAW filter. These waves are then transmitted to an impedance-based sensor, specifically a photodiode in this case. The changes in the sensor state and the resulting changes in impedance lead to a reflectance profile that can be calibrated to infer sensor states. Notably, this invention allows for the passive and wireless sensing of light levels at distances of up to approximately 12 feet.
Career Highlights: Eric is associated with Sandia Corporation, where he collaborates with talented individuals in the field of technology and innovation. His work at the company underlines his dedication to advancing sensor technology through cutting-edge research and application.
Collaborations: Throughout his career, Eric has collaborated with notable coworkers, including Jack L. Skinner and Harvey Ho. Their combined efforts contribute to the development and implementation of sophisticated solutions in the realm of passive wireless sensors, further enhancing the effectiveness and reach of their innovations.
Conclusion: Eric Y. Chu's inventive spirit and contributions to the field continue to inspire ongoing advancements in wireless sensing technology. With the patent for his passive hybrid sensing tag, he has paved the way for new applications and possibilities in the industry, demonstrating the potential of integrating innovative materials and devices for practical use.