Company Filing History:
Years Active: 2018-2020
Title: Innovations by Eric T Corriveau in Electronic Device Structures
Introduction
Eric T Corriveau is an accomplished inventor based in Bristol, CT (US). He has made significant contributions to the field of electronic devices, particularly in the techniques for joining structural features within these devices. With a total of 2 patents to his name, Corriveau's work showcases innovative methods that enhance the functionality and durability of electronic enclosures.
Latest Patents
Corriveau's latest patents focus on advanced techniques for bonding structural features together in the enclosures of electronic devices. One of his notable inventions involves ultrasonic soldering, which provides structural support while forming a magnetic circuit within the device. This method allows for the bonding of various features to the interior of the enclosure without leaving any visible marks on the exterior. Additionally, he has developed friction welding techniques that enable features to be actuated against the enclosure, ensuring a strong bond without cosmetic deformation. His innovations also include the use of a rotational friction welding machine, which can rotate small diameter features at high speeds to achieve effective bonding.
Career Highlights
Corriveau's career is marked by his association with Apple Inc., where he has been able to apply his inventive skills to cutting-edge technology. His work has contributed to the development of more efficient and reliable electronic devices, making a lasting impact in the industry.
Collaborations
Throughout his career, Corriveau has collaborated with talented individuals such as Steven J Osborne and Joss Nathan Giddings. These partnerships have fostered a creative environment that has led to the successful development of innovative solutions in electronic device design.
Conclusion
Eric T Corriveau's contributions to the field of electronic devices through his innovative patents demonstrate his expertise and commitment to advancing technology. His work not only enhances the functionality of electronic enclosures but also sets a standard for future innovations in the industry.