Company Filing History:
2 out of 2,019 
1 out of 625 
Years Active: 1993
Title: Eric R Edwin: Innovator in Rigid-Flex Printed Circuit Boards
Introduction
Eric R Edwin is a notable inventor based in Tomball, TX (US). He has made significant contributions to the field of printed circuit boards, particularly in the development of multilayer rigid-flex designs. With a total of 2 patents, his work has had a considerable impact on high-volume production environments.
Latest Patents
Eric's latest patents focus on multilayer rigid-flex printed circuit boards designed for use in infrared reflow. These innovative boards feature a rigid section and a flexible section that extends from the rigid part. They are engineered to withstand the high temperatures encountered in production environments that utilize infrared reflow ovens. The design includes spacers and covers that protect the flexible section from extreme heat. Additionally, Eric has disclosed a process for assembling components and devices on these boards in high-volume production settings.
Career Highlights
Throughout his career, Eric has worked with prominent companies such as Compaq Computer Corporation and Teledyne Industries. His experience in these organizations has contributed to his expertise in the field of electronics and circuit board design.
Collaborations
Eric has collaborated with notable individuals in his field, including James J Tumlinson and Jerome A Wilson. These partnerships have likely enriched his work and led to further innovations in printed circuit technology.
Conclusion
Eric R Edwin stands out as an influential inventor in the realm of rigid-flex printed circuit boards. His patents and career achievements reflect his dedication to advancing technology in high-volume production environments.