Eric Paul Vick

Title: The Innovations of Eric Paul Vick

Introduction

Eric Paul Vick is an accomplished inventor based in Raleigh, NC (US). He has made significant contributions to the field of electronics through his innovative patents. His work focuses on enhancing electronic packaging technologies, which are crucial for modern electronic devices.

Latest Patents

One of Eric's notable patents is titled "Electronic packages with three-dimensional conductive planes, and methods for fabrication." This patent describes an electronic package that includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer. This innovation represents a significant advancement in the design and functionality of electronic packages.

Career Highlights

Eric Paul Vick is associated with the Research Triangle Institute, where he has been able to apply his expertise in electronics and materials science. His work has led to the development of cutting-edge technologies that improve the performance and reliability of electronic devices. With 1 patent to his name, Eric has established himself as a key player in the field of electronic packaging.

Collaborations

Eric has worked alongside talented professionals, including his coworker Dorota Temple. Their collaboration has contributed to the advancement of research and development in their field.

Conclusion

Eric Paul Vick's contributions to electronic packaging through his innovative patent demonstrate his commitment to advancing technology. His work continues to influence the electronics industry, paving the way for future innovations.