Eric A Bunn

Title: The Innovations of Eric A. Bunn

Introduction

Eric A. Bunn is an accomplished inventor based in Banks, Oregon. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique retaining ring used in the polishing of semiconductor substrates.

Latest Patents

Eric A. Bunn holds a patent for a retaining ring designed specifically for semiconductor polishing. This retaining ring features a bottom surface that contacts a polishing pad and a top surface that attaches to a carrier head. The top surface is equipped with multiple screw holes and alignment slots. Notably, it includes a first insert positioned in one of the alignment slots, which is flush with or below the top surface. This insert is designed to prevent the insertion of an alignment pin into the alignment slot, showcasing Bunn's innovative approach to enhancing semiconductor processing.

Career Highlights

Eric A. Bunn is currently employed at Applied Materials, Inc., a leading company in the semiconductor industry. His work at Applied Materials has allowed him to collaborate with other talented professionals, including his coworker Liam S. Roberts. Together, they contribute to advancements in semiconductor manufacturing technologies.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Eric A. Bunn's contributions to semiconductor technology through his innovative retaining ring patent exemplify his expertise and dedication to the field. His work continues to impact the industry positively.