Marktl, Germany

Erhard Sitrl


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1980

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Erhard Sitrl: Innovator in Solid Material Cutting

Introduction

Erhard Sitrl is a notable inventor based in Marktl, Germany. He has made significant contributions to the field of material processing, particularly through his innovative patent related to cutting solid materials.

Latest Patents

Erhard Sitrl holds a patent for a "Process for multiple lap cutting of solid materials." This process utilizes a set of parallel, spaced apart blades mounted on the frame of a gang-saw. The blades are designed for reciprocal movement over the solid materials to be cut, operating in a suspension of a lapping abrasive. The process exerts a pressure ranging from 100 to 1,000 gf per blade on the solid material. The free working length of the blades is maintained between 110 to 250 mm, and the pressure applied to the blades is inversely proportional to their length. The blades move through the solid material at a mean lateral speed of 30 to 150 meters per minute.

Career Highlights

Erhard Sitrl is associated with Wacker-Chemitronic für Elektronik Grundstoffe GmbH, where he applies his expertise in material cutting technologies. His innovative approach has led to advancements in the efficiency and effectiveness of cutting processes.

Collaborations

Erhard has collaborated with notable colleagues, including Dieter Regler and Alfred Moritz, who have contributed to his work and innovations in the field.

Conclusion

Erhard Sitrl's contributions to the cutting of solid materials through his patented process exemplify his innovative spirit and dedication to advancing technology in material processing. His work continues to influence the industry and inspire future innovations.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…