Company Filing History:
Years Active: 1994-1997
Title: **Innovative Contributions of Eleftherios Adamopoulos**
Introduction
Eleftherios Adamopoulos is a prominent inventor based in the Bronx, NY, with a remarkable portfolio consisting of four patents. His innovative work primarily focuses on the field of materials science, particularly in adhesive technologies applied to multi-level packaging and electronic circuits.
Latest Patents
Among his latest patents are significant advancements in "Adhesive layer in multi-level packaging" and "Organic material as a metal." These patents disclose the creation of multilayer articles that integrate terminally unsaturated adhesive polyimides adhered to various substrates, enhancing the functionality and durability of electronic components. His inventions include novel formulations of polyimides that serve as both adhesive layers and copper diffusion barriers, crucial for maintaining integrity in complex electronic assemblies.
Career Highlights
Eleftherios currently contributes his expertise at International Business Machines Corporation (IBM), where his work is at the intersection of innovative materials and engineering applications. His dedication to advancing adhesive technologies has positioned him as a key figure in the research and development sector.
Collaborations
Throughout his career, Eleftherios has collaborated with esteemed colleagues, including Kang-Wook Lee and Terrence Robert O'Toole. Together, they have worked on groundbreaking projects that aim to revolutionize the materials used in electronics, showcasing the importance of teamwork and interdisciplinary approaches in driving innovation.
Conclusion
Eleftherios Adamopoulos exemplifies the spirit of innovation through his substantial contributions to adhesive technologies and multi-level packaging systems. His patents not only reflect his individual genius but also signify the collaborative efforts of a dedicated team striving to push the boundaries of what is possible in material science. His work continues to influence the future of electronics packaging and adhesive applications, ensuring a lasting impact in the field.