Elbertus Smalbrugge

Title: Elbertus Smalbrugge: Innovator in Wafer Scale Techniques

Introduction

Elbertus Smalbrugge is a notable inventor based in Eindhoven, Netherlands. He has made significant contributions to the field of semiconductor technology, particularly in the area of wafer scale techniques. His innovative approach has led to the development of a unique method for interconnecting vertically stacked dies.

Latest Patents

Elbertus holds a patent for a "Wafer scale technique for interconnecting vertically stacked dies." This patent describes a method and device for interconnecting stacked die surfaces with electrically conductive traces. The process involves bonding a second die on top of a first die using a photoresist compound, followed by heating and lithography to create a smooth convex bridge between the die surfaces. This innovative technique allows for the formation of electrically conductive traces, enhancing the performance and efficiency of stacked die configurations. He has 1 patent to his name.

Career Highlights

Elbertus Smalbrugge is affiliated with the Technische Universiteit Eindhoven, where he continues to advance research in semiconductor technologies. His work has garnered attention for its potential applications in various electronic devices, making him a key figure in the field.

Collaborations

Elbertus has collaborated with notable colleagues such as Pinxiang Duan and Oded Raz. Their combined expertise has contributed to the advancement of innovative technologies in the semiconductor industry.

Conclusion

Elbertus Smalbrugge's contributions to wafer scale techniques exemplify the importance of innovation in semiconductor technology. His work not only enhances the efficiency of electronic devices but also paves the way for future advancements in the field.