Company Filing History:
Years Active: 2025
Title: Eirini Kakkava: Innovator in Die Bonding Systems
Introduction
Eirini Kakkava is a prominent inventor based in Zurich, Switzerland. She has made significant contributions to the field of die bonding systems, showcasing her expertise and innovative spirit. Her work is characterized by a focus on enhancing the efficiency and accuracy of die bonding processes.
Latest Patents
Eirini Kakkava holds a patent titled "Die bonding systems, and methods of using the same." This patent describes a die bonding system that includes a bond head assembly for bonding a die to a substrate. The system features a first plurality of fiducial markings on the die and a second plurality of fiducial markings on the substrate. An imaging system is integrated to simultaneously image these fiducial markings along two independent optical paths, allowing for precise alignment during the bonding process. This innovation is crucial for improving the reliability and performance of electronic components.
Career Highlights
Eirini Kakkava is associated with Kulicke and Soffa Industries, Inc., a company known for its advanced semiconductor packaging and assembly solutions. Her role in the company has allowed her to apply her inventive skills to real-world applications, contributing to the advancement of technology in the semiconductor industry.
Collaborations
Eirini has collaborated with notable colleagues such as Andreas Marte and Daniel Buergi. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Eirini Kakkava's contributions to die bonding systems exemplify her dedication to innovation in the semiconductor field. Her patent and collaborative efforts highlight her role as a leading inventor in this specialized area.