Eiji Hagimoto

Title: Eiji Hagimoto: Innovator in Chip Package Technology

Introduction

Eiji Hagimoto is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of chip packaging technology, holding a total of 4 patents. His work focuses on enhancing the efficiency and functionality of chip package devices.

Latest Patents

One of Eiji Hagimoto's latest patents is a chip package device that is mountable on a motherboard in either a facedown or wire bonding manner. This innovative device features a plurality of wire bonding electrodes adjacent to facedown electrodes. It includes an integrated circuit (IC) chip with multiple chip electrodes on its face surface. The device also comprises a contact sheet that has a variety of conductor patterns extending through it to connect with the chip electrodes. This design allows for versatile mounting options on printed circuit boards, facilitating both mechanical and electrical connections.

Career Highlights

Eiji Hagimoto is currently employed at NEC Corporation, where he continues to develop cutting-edge technologies in chip packaging. His expertise and innovative approach have positioned him as a key figure in the industry.

Collaborations

Eiji has collaborated with notable coworkers such as Keiichiro Kata and Shuichi Matsuda. Their combined efforts have contributed to advancements in chip packaging solutions.

Conclusion

Eiji Hagimoto's work in chip packaging technology exemplifies innovation and dedication to improving electronic device functionality. His patents reflect a commitment to advancing the field and enhancing the capabilities of modern technology.