Company Filing History:
Years Active: 2023
Title: Eiji Ariizumi: Innovator in Substrate Bonding Technology
Introduction
Eiji Ariizumi is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of substrate bonding technology. His innovative approach aims to enhance the efficiency and effectiveness of substrate bonding processes.
Latest Patents
Ariizumi holds a patent for a substrate bonding apparatus and method designed to improve the throughput of substrate bonding. This apparatus bonds first and second substrates, creating contact regions that enlarge from specific parts of the substrates. The apparatus includes a detecting unit that gathers information about these contact regions and a determining unit that assesses whether the bonding process can proceed based on the detected information. The determining unit can identify if the bonding can continue when the value of the information stabilizes or if the rate of change in the value falls below a predetermined threshold. He has 1 patent to his name.
Career Highlights
Eiji Ariizumi is currently employed at Nikon Corporation, a leading company in imaging and optical products. His work at Nikon has allowed him to focus on advancing substrate bonding technologies, which are crucial in various applications, including semiconductor manufacturing.
Collaborations
Ariizumi has collaborated with notable colleagues such as Isao Sugaya and Yoshiaki Kito. Their combined expertise has contributed to the development of innovative solutions in the field of substrate bonding.
Conclusion
Eiji Ariizumi's contributions to substrate bonding technology exemplify the importance of innovation in enhancing manufacturing processes. His work continues to influence the industry and pave the way for future advancements.