Company Filing History:
Years Active: 2011-2012
Title: Innovations of Eiichi Morisaki in Semiconductor Technology
Introduction
Eiichi Morisaki is a notable inventor based in Kasama, Japan, recognized for his contributions to semiconductor technology. With a total of two patents to his name, Morisaki has made significant advancements in the field, particularly focusing on the reliability and efficiency of power modules.
Latest Patents
Morisaki's latest patents include innovations in semiconductor power modules that utilize Pb-free solder, addressing environmental concerns. His research highlights the challenges faced with conventional solder compositions, particularly Sn-3Ag-0.5Cu, which struggles with reliability under temperature cycling. By doping Sn solder with Indium (In) and Silver (Ag), he discovered a composition, Sn-3Ag-0.5Cu-5In, that enhances the lifespan of the solder at low strain rates. Additionally, he proposed a method for partially coating solder end portions with resin to further improve reliability.
Career Highlights
Eiichi Morisaki is associated with Hitachi, Ltd., where he has been instrumental in developing innovative solutions for semiconductor applications. His work has contributed to the advancement of reliable power modules that are essential in various electronic devices.
Collaborations
Morisaki has collaborated with notable colleagues such as Tasao Soga and Daisuke Kawase, enhancing the research and development efforts within his field.
Conclusion
Eiichi Morisaki's contributions to semiconductor technology, particularly in the development of reliable power modules, underscore his importance as an inventor. His innovative approaches to solder compositions and reliability enhancement continue to influence the industry.