Company Filing History:
Years Active: 2018
Title: Eigo Kondo: Innovator in Polyimide Technology
Introduction
Eigo Kondo is a notable inventor based in Chiba, Japan. He has made significant contributions to the field of materials science, particularly in the development of polyimide resin films. His innovative work has led to advancements that are crucial for various industrial applications.
Latest Patents
Eigo Kondo holds a patent for a unique polyimide resin film and metal-clad laminate. This invention features a resin film where at least one of the polyimide layers is a non-thermoplastic polyimide layer. This layer has a linear thermal expansion coefficient of 1×10 to 30×10 (1/K). The non-thermoplastic polyimide layer is produced by reacting an aromatic tetracarboxylic anhydride with a diamine component. Notably, the diamine component includes a dimer acid-type diamine and an aromatic diamine, with the dimer acid-type diamine comprising 1 to 15 mol % of the total diamine component.
Career Highlights
Eigo Kondo is associated with Nippon Steel & Sumikin Chemical Co., Ltd., where he has been instrumental in advancing polyimide technology. His work has not only contributed to the company's portfolio but has also positioned him as a key figure in the materials science community.
Collaborations
Eigo Kondo has collaborated with notable colleagues such as Akira Mori and Aiko Hara. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Eigo Kondo's contributions to polyimide technology exemplify the impact of innovative thinking in materials science. His patent and collaborations highlight the importance of teamwork in driving advancements in this field.