Edwin Kim

Title: Innovations of Edwin Kim in Barrier Layer Technology

Introduction

Edwin Kim is a notable inventor based in Santa Clara, CA, who has made significant contributions to the field of barrier layer technology. With a total of 2 patents, his work focuses on improving the performance and reliability of metal/conductor filling processes in semiconductor manufacturing.

Latest Patents

Kim's latest patents include groundbreaking techniques for sputter deposited barrier layers. His discoveries involve a specific order of depositing various film layers using a combination of Ion Metal Plasma (IMP) and traditional sputter deposition techniques. This innovative approach results in a barrier layer structure that provides excellent barrier properties, allowing for metal/conductor filling of contact sizes down to 0.25 microns and smaller without junction spiking. The process involves multiple layers, including a first layer of barrier metal, an oxygen-stuffed barrier metal, a nitride of a barrier metal, and a wetting layer, all deposited under optimal conditions to enhance performance.

Career Highlights

Edwin Kim has established himself as a key figure in the semiconductor industry through his work at Applied Materials, Inc. His expertise in barrier layer technology has led to advancements that significantly improve the efficiency and effectiveness of semiconductor devices.

Collaborations

Throughout his career, Kim has collaborated with talented professionals such as Michael Nam and Chris Cha. These partnerships have fostered an environment of innovation and have contributed to the successful development of his patented technologies.

Conclusion

Edwin Kim's contributions to barrier layer technology exemplify the impact of innovative thinking in the semiconductor industry. His patents not only enhance manufacturing processes but also pave the way for future advancements in the field.