Company Filing History:
Years Active: 1991
Title: **Edward M. Berger: Innovator in Dispensing Display Package Design**
Introduction
Edward M. Berger, based in Chatsworth, CA, is an inventive mind recognized for his contribution to packaging solutions. With a focus on practicality and functionality, he holds a notable patent that reflects his innovative approach to product design.
Latest Patents
Edward M. Berger has been granted a patent for a "Dispensing display package for small balls." This unique thermoformed package serves a dual purpose, acting both as a closed package and a dispenser for small balls, such as bbs. The design features a rotatable cover mounted on a cup-shaped base, allowing users to easily switch between packaging and dispensing modes. The inclusion of a detent stop structure ensures that the cover remains securely in place, whether opened or closed. Additionally, the package can accommodate balls larger than its primary design through a knockout feature in the cover. With interlocking peripheral flanges to demountably hold the base and cover together, the package also boasts a transparent portion for visibility of the ball load.
Career Highlights
Edward has made significant strides in the field of packaging while working at Plastofilm Industries, Inc. His inventive work has contributed to advancements in how products are presented and dispensed. His patent underscores a commitment to enhancing user experience and packaging efficiency.
Collaborations
Throughout his career, Edward has collaborated with talented individuals such as David B. Rosten and Douglas E. Foos. These partnerships have fostered innovative solutions and have played a role in advancing their collective work in packaging technology.
Conclusion
Edward M. Berger stands out as an innovative inventor with a clear vision for practical design. His patent for a dispensing display package demonstrates not only his creativity but also his ability to improve everyday products. With a continued focus on invention and improvement, Edward is likely to further impact the field of packaging solutions in the future.