Glen Rock, PA, United States of America

Edward Lee Hengst

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: Te Connectivity Services Gmbh, Tyco Electronics Corporation, Tyco Electronics Japan G.k.. Active years: 2016-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Edward Lee Hengst. Retrieved from https://idiyas.com/inventor/edward-lee-hengst

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 9.3

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2016-2022

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Unveiling the Innovations of Edward Lee Hengst from Glen Rock, PA

Introduction:

Edward Lee Hengst is a brilliant inventor based in Glen Rock, PA, with a remarkable portfolio of two patents that revolutionize header assemblies and electrical connector systems.

Latest Patents:

His latest patents showcase his expertise in engineering advanced solutions:

1. Contact module for a header assembly: Inventive header assembly featuring contact modules with ground shields for enhanced electrical shielding.

2. Electrical connector assembly with signal modules and ground shields: Mezzanine connector system housing signal channels and ground channels for efficient signal transmission.

Career Highlights:

Edward Lee Hengst has made significant contributions to the field of electrical engineering through his work at prestigious companies. He notably worked at Tyco Electronics Corporation and Tyco Electronics Japan G.k., where his innovative mindset flourished.

Collaborations:

Throughout his career, Edward collaborated with esteemed professionals such as Wayne Samuel Davis and Michael James Horning. Together, they pushed boundaries and created groundbreaking solutions in the realm of electrical engineering.

Conclusion:

In conclusion, Edward Lee Hengst's inventive spirit and dedication to advancing technology have led to transformative innovations in the realm of header assemblies and electrical connectors. His contributions continue to shape the industry, setting new standards for electrical engineering excellence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…