Glen Rock, PA, United States of America

Edward Lee Hengst

USPTO Granted Patents = 2 

Average Co-Inventor Count = 9.3

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2016-2022

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2 patents (USPTO):Explore Patents

Title: Unveiling the Innovations of Edward Lee Hengst from Glen Rock, PA

Introduction:

Edward Lee Hengst is a brilliant inventor based in Glen Rock, PA, with a remarkable portfolio of two patents that revolutionize header assemblies and electrical connector systems.

Latest Patents:

His latest patents showcase his expertise in engineering advanced solutions:

1. Contact module for a header assembly: Inventive header assembly featuring contact modules with ground shields for enhanced electrical shielding.

2. Electrical connector assembly with signal modules and ground shields: Mezzanine connector system housing signal channels and ground channels for efficient signal transmission.

Career Highlights:

Edward Lee Hengst has made significant contributions to the field of electrical engineering through his work at prestigious companies. He notably worked at Tyco Electronics Corporation and Tyco Electronics Japan G.k., where his innovative mindset flourished.

Collaborations:

Throughout his career, Edward collaborated with esteemed professionals such as Wayne Samuel Davis and Michael James Horning. Together, they pushed boundaries and created groundbreaking solutions in the realm of electrical engineering.

Conclusion:

In conclusion, Edward Lee Hengst's inventive spirit and dedication to advancing technology have led to transformative innovations in the realm of header assemblies and electrical connectors. His contributions continue to shape the industry, setting new standards for electrical engineering excellence.

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