Edward L Yankowski

Title: Edward L Yankowski: Innovator in Circuit Package Fabrication

Introduction

Edward L Yankowski is a notable inventor based in Hyde Park, NY (US). He has made significant contributions to the field of electronics, particularly in the fabrication of circuit packages. His innovative approach has led to advancements that enhance the reliability and efficiency of electronic interconnections.

Latest Patents

Yankowski holds a patent for a process of fabricating a circuit package. This low-cost process focuses on creating solder column interconnections for electronic packages. The method involves filling an array of pin holes in a pin mold with lead/tin solder, which aligns with the conductive pads on a chip carrier. By heating the solder, it becomes molten and bonds with the conductive pads, forming miniature pins. This process is designed for mass production, ensuring high-density electrical interconnections between chip carriers and supporting circuit boards.

Career Highlights

Edward L Yankowski has had a distinguished career at International Business Machines Corporation (IBM). His work has been pivotal in developing technologies that support modern electronic devices. With a focus on innovation, he has contributed to the advancement of circuit packaging techniques that are essential for the electronics industry.

Collaborations

Yankowski has collaborated with notable colleagues, including John R Behun and William Miller. These partnerships have fostered an environment of innovation and creativity, leading to significant advancements in their respective fields.

Conclusion

Edward L Yankowski's contributions to circuit package fabrication exemplify the spirit of innovation in the electronics industry. His patent and collaborative efforts have paved the way for more efficient and reliable electronic interconnections. His work continues to influence the future of technology.