Edward L Lee

This inventor holds 7 USPTO granted patents and 2 published patent applications, plus 3 CIPO patents and 3 EPO patents. Top assignees: Dow Global Technolgoies LLC, Pbbpolisur S.r.l., Performance Materials Na, Inc.. Active years: 2018-2026.

USPTO Granted Patents = 7 (Patent Applications = 2)

% Patents Active = 57.1

CIPO Patents = 3 (Patent Applications = 1)

EPO Patents = 3 (Patent Applications = 8)

Average Co-Inventor Count = 3.9

ph-index = 1

Forward Citations = 1(Granted Patents)

Location History:

Willowbrook, IL (US) (2018)
Singapore, SG (2021 - 2023)

Company Filing History:

7 out of 4,798

Dow Global Technolgoies LLC

Performance Materials Na, Inc.

patents

where one patent can have more than one assignee

Years Active: 2018-2026

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7 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12661876 - Barrier laminates including ethylene copolymer extruded web layers (2026-06-23),

2. 12576621 - Adhesiveless thermally laminated barrier heat sealing films including polyethylene (2026-03-17),

3. 11833807 - Flexible packaging film laminates and method of making same via thermal lamination (2023-12-05),

4. 11312844 - Compositions suitable for manufacturing polyethylene foam, and articles thereof (2022-04-26),

5. 11312120 - Low temperature multilayer shrink films, and methods of making thereof (2022-04-26),

6. 11111322 - Low density ethylene-based polymers for low speed extrusion coating operations (2021-09-07),

7. 9882214 - Lithium metal oxide cathode materials and method to make them (2018-01-30),

Title: The Innovative Contributions of Edward L Lee

Introduction

Edward L Lee is a notable inventor based in Singapore, recognized for his significant contributions to the field of flexible packaging. With a total of five patents to his name, Lee has made strides in developing advanced materials that enhance packaging efficiency and sustainability.

Latest Patents

Among his latest patents, Lee has developed "Flexible packaging film laminates and method of making same via thermal lamination." This innovation focuses on multilayer film embodiments that utilize thermal lamination without adhesives, employing tie layers made from a blend of ethylene acrylate copolymer and an anhydride grafted ethylene alpha-olefin copolymer. Another significant patent is for "Low temperature multilayer shrink films, and methods of making thereof." This invention features a multilayer shrink film that includes at least one core layer situated between two skin layers, utilizing an ethylene/alpha-olefin interpolymer composition and low-density polyethylene.

Career Highlights

Edward L Lee has worked with prominent companies such as Dow Global Technologies LLC and Pbbpolisur S.r.l. His experience in these organizations has allowed him to refine his expertise in materials science and packaging technology.

Collaborations

Throughout his career, Lee has collaborated with talented individuals, including Cornelis F J Den Doelder and Nhi T Y Dang. These partnerships have contributed to the successful development of his innovative patents.

Conclusion

Edward L Lee's work in flexible packaging has made a significant impact on the industry, showcasing his dedication to innovation and sustainability. His patents reflect a commitment to advancing technology in packaging materials.