Edward J Bonafino

Title: Edward J Bonafino: Innovator in Electronic Circuit Packages

Introduction

Edward J Bonafino is a notable inventor based in Endwell, NY (US). He has made significant contributions to the field of electronic packaging, particularly with his innovative designs that enhance the durability and functionality of electronic components. His work is recognized for its technical sophistication and practical applications in the industry.

Latest Patents

Edward J Bonafino holds a patent for "Electronic circuit packages with tear resistant organic cores." This invention discloses an electronic package and electronic package module that features a dielectric core with surface circuitization on at least one surface. The core is a composite that includes a thermoplastic layer interposed between two separate layers of thermoset adhesive, such as epoxy dicyanate adhesive. The thermoplastic layer is preferably made of polyimide, while the adhesive can be a homogeneous film of thermoset resin or a fiber-reinforced thermoset resin. This innovative design allows for the manufacture of a thin core that is particularly amenable to production.

Career Highlights

Edward J Bonafino is associated with International Business Machines Corporation (IBM), where he has contributed to various projects and innovations in electronic packaging. His expertise in materials science and engineering has played a crucial role in advancing the technology used in electronic devices.

Collaborations

Throughout his career, Edward has collaborated with notable colleagues, including Richard W Carpenter and Peter J Lueck. These collaborations have fostered a creative environment that has led to the development of cutting-edge technologies in the field.

Conclusion

Edward J Bonafino is a distinguished inventor whose work in electronic circuit packages has made a lasting impact on the industry. His innovative designs and collaborations continue to influence advancements in electronic packaging technology.