Location History:
- Chicopee, MA (US) (2006)
- West Springfield, MA (US) (2010 - 2014)
Company Filing History:
4 out of 81 
2 out of 4,636 
Years Active: 2006-2014
Title: **Edmund P. Taddey: Innovator in Cooling Technologies**
Introduction
Edmund P. Taddey, based in West Springfield, MA, is a notable inventor recognized for his contributions to cooling technologies through innovative engineering solutions. With six patents to his name, Taddey has been instrumental in developing methods and devices that enhance thermal management in electronic applications.
Latest Patents
Among his latest innovations, Taddey holds a patent for a **Structural Assembly for Cold Plate Cooling**. This device features a structural member with a heat spreader that directly supports an electronic device. Additionally, it includes a cold plate mounted to the heat spreader, maximizing cooling efficiency. Another of his significant patents concerns the **Method of Joining Graphite Fibers to a Substrate**. This method describes a process of creating a metallic-graphite structure by applying metallization material to graphite fibers and securing a metallic substrate to the wetted graphite subassembly.
Career Highlights
Taddey's professional journey includes significant stints at **Hamilton Sundstrand Space Systems International, Inc.** and **Hamilton Sundstrand Corporation**, where he applied his expertise in engineering and innovation. His work has directly contributed to advancements in aerospace technologies, showcasing his ability to integrate theoretical knowledge with practical applications.
Collaborations
Throughout his career, Edmund P. Taddey has collaborated with esteemed colleagues such as Mark A. Zaffetti and Durwood Mace Beringer. These partnerships reflect a commitment to fostering innovative solutions in engineering through shared knowledge and teamwork.
Conclusion
Edmund P. Taddey's innovative approach to cooling technologies and his impressive portfolio of patents firmly establish him as a key figure in his field. His work continues to impact the development of more efficient electronic devices, paving the way for future advancements in thermal management solutions.