Location History:
- Düsseldorf, DE (2011)
- Dusseldorf, DE (2015)
Company Filing History:
1 out of 2,062 
1 out of 5,278 Years Active: 2011-2015
Title: The Innovations of Eckhard Pürkner
Introduction
Eckhard Pürkner is a notable inventor based in Düsseldorf, Germany. He has made significant contributions to the field of adhesive technology, particularly in the development of hot-melt adhesives for packaging applications. His innovative approach has led to the creation of a unique adhesive formulation that enhances the functionality of resealable packaging.
Latest Patents
Eckhard Pürkner holds a patent for a coextrudable hot-melt adhesive. This adhesive is designed for resealable packaging and contains 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene, along with C to C-α-olefins. The copolymer is obtainable through metallocene-catalyzed polymerization, featuring a melt index of 5 to 100 g/10 min (DIN ISO 1133). The formulation also includes 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140 °C, 0 to 15 wt. % of waxes with a melting point of 120 to 170 °C, and 0.1 to 20 wt. % of additives and auxiliaries. The adhesive exhibits a viscosity ranging from 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190 °C.
Career Highlights
Eckhard Pürkner is associated with Henkel AG & Company, KGaA, a leading global company in adhesive technologies. His work at Henkel has allowed him to focus on innovative solutions that meet the evolving needs of the packaging industry. His expertise in adhesive formulations has positioned him as a key contributor to the company's research and development efforts.
Collaborations
Eckhard has collaborated with notable colleagues such as Marcus Heemann and Volker Erb. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge adhesive technologies.
Conclusion
Eckhard Pürkner's contributions to adhesive technology, particularly through his patented hot-melt adhesive, demonstrate his commitment to innovation in the packaging industry. His work continues to influence the development of effective and efficient packaging solutions.