Yongin-si, South Korea

Duck-Nam Kim


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Duck-Nam Kim

Introduction

Duck-Nam Kim is a distinguished inventor based in Yongin-si, South Korea, known for his significant contribution to the field of semiconductor technology. With a patent to his name, Kim has played a pivotal role in advancing manufacturing processes that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

Duck-Nam Kim's patent, titled "Methods of Manufacturing Semiconductor Devices," outlines an innovative approach to semiconductor fabrication. This patent describes a method that encompasses various steps, including the formation of an interlayer insulating layer on a substrate, the development of first and second mask layers, and the precise patterning of these layers through etching processes. Notably, the method results in a first mask pattern that is narrower than the photoresist pattern, optimizing the fabrication process for improved device performance.

Career Highlights

Currently, Duck-Nam Kim is affiliated with Samsung Electronics Co., Ltd., a global leader in technology and innovation. His work within such a prominent company underscores his expertise and the impact of his contributions in the semiconductor field. His singular patent reflects his dedication to improving manufacturing techniques and enhancing device functionality.

Collaborations

Throughout his career, Duck-Nam Kim has collaborated with esteemed colleagues, including Hyunki Lee and Keunhee Bai. Their teamwork has likely fostered an environment of creativity and innovation, facilitating advancements in semiconductor device technology.

Conclusion

Duck-Nam Kim’s inventive spirit and dedication to research have positioned him as a key player in the semiconductor industry. With a patent that signifies a leap forward in manufacturing processes, Kim’s contributions continue to influence the technological landscape, demonstrating the power of innovation in enhancing device capabilities.

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