Douglas H Teramura

Title: Douglas H Teramura: Innovator in Electroless Plating Solutions

Introduction

Douglas H Teramura is a notable inventor based in Creve Coeur, MO (US). He has made significant contributions to the field of electroless plating solutions, showcasing his expertise through his innovative patent.

Latest Patents

Teramura holds a patent for "Viscous electroless plating solutions." This invention involves viscous aqueous electroless plating solutions that comprise ionic depositable metal species such as copper or nickel. The solutions also include a metal complexing agent like EDTA, a metal reducing agent such as formaldehyde or hypophosphite, and a thickener such as xanthan gum, silica, or carboxymethylcellulose. These solutions have a viscosity greater than 50 cp, reaching up to 20,000 cp. They are particularly useful for electrolessly depositing metal onto moving or inclined catalytic substrates and serve as components in kits for applying electrolessly deposited metal images to various surfaces.

Career Highlights

Teramura has worked with Monsanto Company, where he has applied his knowledge and skills in the development of innovative plating solutions. His work has contributed to advancements in the field, enhancing the efficiency and effectiveness of electroless plating processes.

Collaborations

Throughout his career, Teramura has collaborated with notable colleagues, including Albert W Morgan and George D Vaughn. These collaborations have fostered a creative environment that has led to significant advancements in their respective fields.

Conclusion

Douglas H Teramura is a distinguished inventor whose work in viscous electroless plating solutions has made a lasting impact on the industry. His innovative approach and collaboration with esteemed colleagues highlight his commitment to advancing technology in plating solutions.