Douglas A Knapp

Title: Innovations by Douglas A. Knapp

Introduction

Douglas A. Knapp is an accomplished inventor based in Tipton, Indiana, known for his contributions to the field of wafer bonding technology. He holds a total of 2 patents, showcasing his innovative approach to solving complex engineering challenges. His work primarily focuses on methods that enhance the efficiency and effectiveness of packaging processes in electronic devices.

Latest Patents

One of his latest patents is titled "Glass frit wafer bonding process and packages formed thereby." This invention presents a method for glass frit bonding wafers to create a package, emphasizing the minimization of the glass bond line width between the wafers. By utilizing a glass frit material that contains a particulate filler, the invention establishes the necessary stand-off distance between the wafers without relying on discrete structural features. Furthermore, the amount of glass frit material used is reduced, allowing for a smaller overall package size. The invention also includes storage regions defined by walls adjacent to the glass bond line, which accommodate excess glass frit material while ensuring adequate flow around electrical runners and into isolation trenches.

Career Highlights

Douglas A. Knapp is currently employed at Delphi Technologies, Inc., where he continues to innovate and develop new technologies. His work has significantly impacted the field of electronic packaging, making processes more efficient and cost-effective.

Collaborations

Throughout his career, Knapp has collaborated with various professionals, including his coworker Larry Lee Jordan, to advance the development of innovative technologies in the industry.

Conclusion

Douglas A. Knapp's contributions to wafer bonding technology exemplify the spirit of innovation in engineering. His patents reflect a commitment to improving electronic packaging processes, making him a notable figure in the field.