Beijing, China

Dongxiao Liu


 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations of Dongxiao Liu in Heat Transfer Technology

Introduction

Dongxiao Liu is a notable inventor based in Beijing, China. He has made significant contributions to the field of heat transfer technology, particularly through his innovative designs and patents. His work focuses on enhancing the efficiency and performance of evaporators and heat pipes.

Latest Patents

One of Dongxiao Liu's key patents is titled "Positive-pressure-withstanding high-power flat evaporator, processing methods thereof and flat loop heat pipe based on evaporator." This invention provides a solution for creating a flat evaporator that can withstand positive pressure. The design includes a housing, reinforcing ribs, and a capillary wick, which collectively ensure the structural integrity of the evaporator. The capillary wick is composed of four distinct parts: an evaporating wick, a heat insulating wick, a sealing wick, and a transfer wick. This innovative arrangement allows for low flow resistance in liquid supply, significantly improving the heat transfer capability of the loop heat pipe and addressing challenges associated with large-area evaporators. Dongxiao Liu holds 1 patent for this invention.

Career Highlights

Throughout his career, Dongxiao Liu has worked with esteemed organizations, including the Beijing Institute of Spacecraft System Engineering. His expertise in heat transfer technology has positioned him as a valuable asset in the field.

Collaborations

Dongxiao Liu has collaborated with notable colleagues such as Guoguang Li and Hongxing Zhang. Their combined efforts have contributed to advancements in heat transfer technologies and innovations.

Conclusion

Dongxiao Liu's contributions to the field of heat transfer technology through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence advancements in evaporator and heat pipe design, showcasing the potential for improved efficiency in thermal management systems.

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