Dong-Ya Wang

Title: The Innovative Mind of Dong-Ya Wang

Introduction

Dong-Ya Wang is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of packaging technology. With a total of 2 patents to his name, his work reflects a commitment to innovation and practicality.

Latest Patents

Dong-Ya Wang's latest patents include a unique package box design. This package box features a substrate board with a plurality of projections. The projections are strategically formed on the substrate board, which consists of a first surface and a second surface. The first surface protrudes toward the second surface, creating a functional and efficient design. Another notable patent is the package case, which showcases his expertise in creating practical packaging solutions.

Career Highlights

Throughout his career, Dong-Ya Wang has worked with several reputable companies. He has been associated with Hongfujin Precision Electronics (Zhengzhou) Co., Ltd. and Hon Hai Precision Industry Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Dong-Ya Wang has collaborated with talented individuals in his field. Notable coworkers include Yu-Ching Liu and Xi-Hang Li. Their collective efforts have fostered an environment of creativity and innovation.

Conclusion

Dong-Ya Wang's contributions to packaging technology exemplify his innovative spirit and dedication to improving everyday products. His patents reflect a deep understanding of practical design, making him a noteworthy figure in the field of invention.