Taipei, Taiwan

Dong-Ren Peng


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2024

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2 patents (USPTO):Explore Patents

Title: Innovations of Dong-Ren Peng

Introduction

Dong-Ren Peng is a notable inventor based in New Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is for a "Packaged isolation barrier with integrated magnetics." This apparatus includes a laminate with a dielectric layer and a conductive layer that forms a circuit element. Additionally, it features a magnetic layer that is coplanar with the laminate's edge surfaces. Another patent involves a "Semiconductor die mounted in a recess of die pad." This semiconductor chip package includes a conductive terminal and a die pad with a recess for the semiconductor die, which is coupled with a wire bond and covered by a mold compound.

Career Highlights

Dong-Ren Peng is currently employed at Texas Instruments Corporation, where he continues to develop innovative solutions in semiconductor packaging. His work has contributed to advancements in the efficiency and functionality of electronic devices.

Collaborations

He has collaborated with notable coworkers, including Hung-Yu Chou and Chung-Hao Lin, who share his commitment to innovation in technology.

Conclusion

Dong-Ren Peng's contributions to semiconductor technology through his patents and work at Texas Instruments Corporation highlight his role as a key innovator in the field. His inventions continue to influence the development of advanced electronic components.

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