Company Filing History:
Years Active: 2025
Title: Innovations of Dong-Quan Yeh in Polymer Composite Materials
Introduction
Dong-Quan Yeh is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of polymer composite materials, particularly in the realm of three-dimensional printing. His innovative approach has led to advancements that enhance the efficiency and effectiveness of 3D printing technologies.
Latest Patents
Dong-Quan Yeh holds a patent for a "Preparation method for polymer composite particle material, and three-dimensional printing method by using polymer composite particle material." This invention provides a polymer composite particle material specifically designed for three-dimensional printing. The material is created by embedding carbon powder on the surface of polymer powder. During the mixing process, a device that applies shear force is utilized, and heating occurs to facilitate melting at the surface of the polymer powder. This results in a shell-core structure where the carbon powder is uniformly coated, ensuring that it does not easily separate from the polymer powder. The preparation method is straightforward and does not require additional dispersants or binders, which simplifies the process. Furthermore, the agglomerated carbon powder can be effectively dispersed, reducing laser reflectivity during printing.
Career Highlights
Dong-Quan Yeh is affiliated with National Taiwan University, where he continues to engage in research and development in the field of materials science. His work has garnered attention for its practical applications in modern manufacturing and technology.
Collaborations
He has collaborated with notable colleagues, including Yu-Deh Chao and Jeng-Ywan Jeng, contributing to a dynamic research environment that fosters innovation and discovery.
Conclusion
Dong-Quan Yeh's contributions to polymer composite materials and three-dimensional printing represent a significant advancement in the field. His innovative methods and collaborative efforts continue to influence the landscape of materials science and engineering.