Company Filing History:
Years Active: 1990-1994
Title: The Innovations of Donald G. Whyman
Introduction
Donald G. Whyman is an accomplished inventor based in Victor, NY (US). He has made significant contributions to the field of materials science, particularly in the development of innovative composite materials. With a total of 2 patents to his name, Whyman's work has had a notable impact on various applications.
Latest Patents
Whyman's latest patents include a "Sheet material with improved cut resistance" and a "White opaque opp film for tamper evident package." The first patent describes a composite material that features a base liner with a release layer, designed to enhance cut resistance during die cutting or perforating processes. This innovation ensures that the cutter does not penetrate the base liner significantly, thereby maintaining the integrity of the material. The second patent focuses on a tamper-evident film that includes a hydrocarbon polymer core layer, which is enhanced with a tamper-evident layer that induces cavitation upon orientation. This film is designed to provide a secure seal for tamper-evident packaging.
Career Highlights
Donald G. Whyman is currently employed at Mobil Oil Corporation, where he continues to innovate and develop new materials. His work at Mobil has allowed him to apply his expertise in materials science to real-world applications, contributing to the company's advancements in packaging and safety.
Collaborations
Throughout his career, Whyman has collaborated with notable colleagues, including Leland L. Liu and Michael T. Heffelfinger. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Donald G. Whyman's contributions to the field of materials science through his patents and work at Mobil Oil Corporation highlight his innovative spirit and dedication to advancing technology. His inventions continue to influence the industry and pave the way for future developments.