Donald F Hiscock

Title: Innovations of Donald F. Hiscock in Starch Adhesive Bonding

Introduction

Donald F. Hiscock, an inventive mind based in Columbus, OH, has made significant contributions in the field of adhesive bonding technologies. With a total of four patents to his name, Hiscock's work primarily focuses on improving the efficiency and effectiveness of starch adhesive bonding, particularly in the manufacturing of corrugated board products.

Latest Patents

One of Hiscock's notable patents is a method and apparatus for starch adhesive bonding of paper, paperboard, and natural cellulosic-fiber materials. This innovative technique is especially relevant for the production of liner and fluted corrugating medium. The patented method involves applying an adhesive coating—consisting of starch and water—onto a first substrate (such as the tips of the flutes of a corrugated medium). The technique requires the contact of this applied coating with another substrate (like a liner) while also engaging ultrasonic energy to enhance the adhesion of the coating to both substrates. The corresponding apparatus is designed to include ultrasonic energy generating mechanisms that form a nip with various components, facilitating the process of bonding paper and starch adhesive effectively.

Career Highlights

Throughout his career, Donald F. Hiscock has collaborated with prominent organizations. Notably, he worked with the Battelle Memorial Institute and the Mead Corporation, where he leveraged his innovative talents to develop advanced adhesive technologies and processes.

Collaborations

In his professional journey, Hiscock has had the opportunity to work alongside esteemed colleagues, including Ralph E. Beard and Herbert N. Johnston. Their partnerships have contributed significantly to the successful development and implementation of adhesive bonding innovations.

Conclusion

Donald F. Hiscock's inventive contributions in starch adhesive bonding demonstrate his commitment to enhancing manufacturing methods in the paper and packaging industries. His continued innovation holds the potential to influence the future of adhesives and their applications widely.