College Park, MD, United States of America

Don L Devoe

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2020-2023

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2 patents (USPTO):Explore Patents

Title: The Innovations of Don L Devoe

Introduction

Don L Devoe is an accomplished inventor based in College Park, MD (US). He has made significant contributions to the field of fluidic chips through his innovative patents. With a total of two patents to his name, Devoe's work focuses on the integration of porous polymer monoliths into fluidic systems.

Latest Patents

One of Don L Devoe's latest patents is titled "Integration of ex situ fabricated porous polymer monoliths into fluidic chips." This patent describes various methods for incorporating bare porous polymer monoliths into fluidic chips. The bare porous polymer monoliths can be fabricated ex situ in a mold and can also be functionalized ex situ. The incorporation process may involve inserting the monoliths into channels of channel substrates of the fluidic chips. Additionally, bonding a capping layer to the channel substrate is part of the integration process. The monoliths can be mechanically anchored to channel walls and the capping layer. Functionalization of the bare porous polymer monoliths can be achieved through ex situ immobilization of capture probes or direct attachment of chitosan.

Career Highlights

Don L Devoe is affiliated with the University System of Maryland, where he continues to advance his research and innovations. His work has garnered attention in the scientific community, particularly in the area of fluidic chip technology.

Collaborations

Some of his notable coworkers include Eric L Kendall and Erik Wienhold, who have collaborated with Devoe on various projects.

Conclusion

Don L Devoe's contributions to the field of fluidic chips through his innovative patents highlight his expertise and dedication to advancing technology. His work continues to influence the development of new applications in this area.

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